Yingxinyuan Int'l(Group) Ltd.
YingXinYuan Electronic Technology Co., Ltd.
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Electronic IC Chip Xilinx XC5VLX330-1FFG1760C
| ECAD Module | Build or Request PCB Footprint or Symbol |
| Supply and Demand Status | Balance |
| Popularity | High |
| Fake Threat In the Open Market | 79 pct. |
| Quantity per package | 1 |
| HTSUS | 8542.39.0001 |
| REACH Status | REACH Unaffected |
| MSL Level | 4 (72 Hours) |
| Case / Package | 1760-FCBGA (42.5x42.5) |
| ECCN | 3A001A7A |
| Mounting | Surface Mount |
| Family Name | XC5VLX330 |
| Package | Tray |
| Package | 1760-BBGA, FCBGA |
| Operating Temperature Range | 0°C ~ 85°C (TJ) |
| Number of I/O | 1200 |
| Estimated Pruduction Lead Time | 51 Weeks |
| Categories | Integrated Circuits (ICs) |
| Series | Virtex®-5 LX |
| Manufacturer | Xilinx Inc. |
| Features | series Field Programmable Gate Array (FPGA) IC 1200 10616832 331776 1760-BBGA, FCBGA |